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IN267994: A improved rapid curing process for the preparation of polymer composites using dielectric molds

The invention provides an improved rapid curing process for the preparation of fiber reinforced polymer composite using dielectric mold. The process highlights the use of a conveyorised microwave system for volumetric cure of the component. The MW absorbing dielectric moulds, with known microwave penetration depth, conducts the heat generated to the working material. The rest is absorbed by the working material or polymer composite, resulting in volumetric inside-out heating. This synergistic heating coupled with a defined power density within the cavity results in more uniform, through-the-thickness cure of composite products. This process also leads to improved cure speeds and large savings in energy consumption along with enhanced service temperature limits and mechanical properties (tensile, compression, flexural and inter laminar shear strengths) of the cured product as compared to the conventional thermal cure processes.
Patent No:
IN267994
Application No:
2373DEL2007
Filing Date:
13-11-2007
Issue Date:
11-08-2015
Applicant:
CSIR-National Aerospace Laboratories (CSIR-NAL), Bengaluru
Inventor(s):
Raja Manuri Venkata Gopala Krishna Rao, Sandhya Rao
IPC Classification:
C08G73/16, C07D 213/20
Indian Classification:
FI16
Country:
India
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