Research Projects

Global digitalization, widespread mobile internet connectivity, and the rise of artificial intelligence (AI) applications have transformed data into the most valuable resource. The exponential growth in data generation and consumption has created a pressing need for higher data transfer rates in both wired and wireless networks. Sixth generation (6G) communication is expected to enable terabit-per-second (Tbps) transmission, with terahertz (THz) frequency bands playing a critical role due to their large spectral bandwidth (spanning tens of gigahertz). However, research into developing on-chip THz devices for high-speed communication remains in its early stages. To address this, various dielectric waveguides have been explored for on-chip THz devices, including unclad ribbon waveguides, silicon-on-insulator (SOI) waveguides, effective media cladded waveguides, and photonic crystal waveguides. However, these conventional approaches face challenges such as fabrication imperfections and significant bending losses at sharp curves. To overcome these limitations, I propose designing and developing THz on-chip devices, such as waveguides and filters, using the principles of “topological photonics”6. Topological photonics has emerged as a promising field in photonics as it offers robust transport of light. The introduction of topology endows traditional photonic systems with remarkable properties, such as unidirectional propagating of light and robustness against impurities or defect without backscattering. To date, topological photonics has been utilized mostly for experimenting and testing the concepts imported from condensed matter physics, such as quantum Hall, quantum spin Hall and quantum valley Hall effects. In contrast, only a relatively small subset of the myriads of possible topological phenomena has been explored experimentally and utilized for practical applications. This project aims to expand the scope of topological photonics to realize groundbreaking applications, ranging from high-speed on-chip communication to innovative optoelectronic devices, driving advancements in next-generation 6G communication technologies. The objectives of the proposal are following: Objective1: Optimization of VPC Heterostructure through 3D Full-Wave Simulation Objective 2: Optimization of Fabrication Procedure Objective 3: Mask Design and Tape-Out for Fabrication Objective 4: Experimental Characterization of the VPC Heterostructure Objective 5: High-Speed Communication via the VPC Heterostructure