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Development of Codeposition electrolyte system for deposition of Binary and Ternary Sn-Ag-Cu based leadfree solder alloys for PCB applications

Funding Organization
Quick Information
Area of Research
Material Sciences
Focus Area
Development of Codeposition electrolyte system
Start Date
2016
End Date
2019
Sanction Amount
₹ 68.17 L
Status
Completed
Contact
shany@cmet.gov.in
Output
No. of Research Paper
00
Technologies (If Any)
00
No. of PhD Produced
00
Publications
00
No. of Patents
Filed : 00
Grant : 00
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