Development of a promising material for electrical engineering based on powdered copper alloys with nanocrystalline dispersed tungsten inclusions
Implementing Organization
National Institute Of Advanced Manufacturing Technology, Jharkhand
Principal Investigator
Dr. Debdas Roy
National Institute Of Advanced Manufacturing Technology, Jharkhand
CO-Principal Investigator
Dr. Partha Sarathi Mondal
National Institute Of Advanced Manufacturing Technology, Jharkhand
About
Copper is a popular electrical and thermal conductor due to its high electrical and thermal conductivity, corrosion resistance, and low cost. However, pure copper is soft and prone to wear, abrasion, creep, and fatigue. Bulk alloying with metals like Zn, Sn, Si, and Al improves Cu's mechanical strength but affects its electrical conductivity. Alignment with metals like Cr or Be enhances Cu's hardness and wear resistance without compromising conductivity. Mechanical alloying (MA) is a convenient method for synthesis, but the development of a nano-tungsten powder dispersed/extended solid solution of CuCr-Ag/CuCr-Nb has not been explored. Consolidation of mechanically alloyed powders is crucial for developing wear-resistant electrical contacts and components.
National Institute Of Advanced Manufacturing Technology, Jharkhand
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