Research Projects

Precision measurement of surface properties is crucial for applications like material characterization, precision mechanics, thin film metrology, biomechanics, and semiconductor wafer condition monitoring. Techniques like scanning electron microscopes, atomic force microscopes, coordinate measuring machines, and stylus devices are often limited due to limitations such as invasive probe-based operation, bulky design, limited throughput, and specialized operator requirements. The proposed technique aims to develop a robust and compact technique for non-contact, high throughput, and full field inspection of surface micro-structures. The technique uses a common path optical interferometric design, encoded information in an optical interferogram, and robust signal processing algorithms for interferogram demodulation. These algorithms can identify sharp surface features and automate localization of defects. The technique will be tested for practical applications in precision surface topography, sub-micron deformation testing, and micro-scale surface defect identification. The proposed method has potential for practical impact in non-destructive material characterization, semiconductor condition monitoring, and precision mechanics.