Research Projects

Electronic devices have become an integral part of our daily lives, with advancements in technology focusing on high performance and miniaturization. This has led to a rise in flux density due to their high power (17-600 W). To increase the reliability and lifespan of electronic devices, there is a need for efficient methods to satisfy their compact packaging requirements. Passive cooling technologies, such as heat pipes, are effective due to their low maintenance and power-free operation. Heat pipes are ideal for thermal management due to their high heat transfer capacity, quick thermal response, reliability, small size, and lightweight nature. Phase change materials (PCM) are also commonly used for thermal management of electronic components. PCM absorbs energy during melting and releases it during solidification, making it suitable for electronic cooling applications. The low thermal conductivity value of PCM is enhanced by adding Nano-particles, resulting in Nano-enhanced PCM (Ne-PCM). Numerical investigation of Ne-PCM-based heat pipes will be conducted with various combinations of Nano-particles and PCMs to predict their thermal performance. Data will be fed to the Neuro-Genetic technique to optimize the filling/concentration ratio of both nano-particles and PCMs inside the heat pipes. The goal is to develop a wick-less heat pipe using Paraffin wax as the PCM and Aluminum Oxide (Al2O3) as the Nano-particle. Experiments will be conducted on three different cases: a heat pipe filled with DI water, a heat pipe with a storage tank filled with PCM, and a heat pipe filled with Ne-PCM.