Influence of hot-equal channel angular pressing (hot-ECAP) on the microstructure-mechanical properties optimization via stress-induced martensite in metastable beta Ti alloys
Implementing Organization
Indian Institute of Technology (IIT)
Principal Investigator
Dr. Suresh Neelakantan
Indian Institute Of Technology (IIT) Delhi
CO-Principal Investigator
Prof. D. Ravi Kumar
Indian Institute of Technology (IIT)
About
In the proposed study, metastable β-titanium alloys (for example: Ti–5Al–5Mo–5V–3Cr (Ti-5553) and/or Ti-10V-2Fe-3Al (Ti-1023)) would be subjected to large deformation through hot-ECAP (temperatures in the range of 400 to 850 °C) process. It is expected that the SIMT in metastable β-Ti alloys would aid in achieving enhanced grain refinement and dislocation density resulting in improved strength through the ECAP process. The hot-ECAPed material would be followed by an aging process to further improve the alloys strength. The microstructure changes (i.e., grain refinement, phase morphology and SIM fraction) and dislocation density of the hot-ECAPed samples (before aging) would be systematically investigated and co-related with their mechanical properties. The ECAPed samples would be aged in an optimized temperature range of 500 to 750 °C and systematically investigated for their microstructure – mechanical properties correlation.Finally, a comparison of the microstructural features and mechanical properties of both the hot-ECAPed and aged samples of the considered metastable β-Ti alloy would be performed to understand the influence of different processes on the strength – ductiliy correlation.
Patents
0
Source
Source
Science and Engineering Research Board (SERB), DST 2022-23
Science and Engineering Research Board (SERB), New Delhi
Anusandhan National Research Foundation (ANRF)
Quick Information
Area of Research
Engineering Sciences
Start Year
2023
End Year
2026
Sanction Amount
₹ 46.22 L
Status
Ongoing
Contact
sureshn@iitd.ac.in
Output
No. of Research Paper
00
Technologies (If Any)
00
No. of PhD Produced
00
No. of Patents
Filed :00
Grant :00
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