The project proposal describes the development of a novel design for the MEMS-based micro heat pipe arrays, aimed at providing a controlled thermal management solution for microelectronic systems such as VLSI circuits, IC chips etc. The objective of
Section: Engineering Sciences (Research Project)
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Development of
Development of a micro heat pipe for electronics cooling
Research Project › Astronomy & Space Sciences
Design and
Design and development of a battery cooling module using hybrid heat pipe technology for an electric vehicle.
Research Project › Engineering Sciences
Development of
Development of Coil Type Pulsating Heat Pipe acting as turbulence promoter and superconducting fin for heat transfer enhancement in double pipe heat exchanger
Research Project › Engineering Sciences
Design and
Design and development of Micro-cast heat sink out of Al-Si-MWCNT alloy composite for Thermal management of CPUs of High-Performance Servers
Research Project › Engineering Sciences
Development of
Development of a Hybrid Mini Channel Cooling System with Embedded Two-Phase Interfaces for Advanced Thermal Management in 5G/6G Electronic Devices
Research Project › Engineering Sciences
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