Lead Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer
Implementing Organization
Central Electrochemical Research Institute (CECRI)
About
The plated Cu-Sn alloy and Ag-Bi bilayer gives good mechanical properties than Cu-Pb-Sn alloy for bearing applications. With this technology we can eliminate hazardous Pb in the alloy compositions. The technology provide good mechanical properties
and plating rate.
Central Electrochemical Research Institute (CECRI)
Acces sibility Controls