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Physical Sciences

Lead-Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer

Implementing Organization

Central Electrochemical Research Institute (CECRI)

About

Used for bearings.

Outcome / Output

Good mechanical properties , Eliminating hazardous Pb in the alloy composition (Lead free process) , Good cathodic current efficiency , Good plating rate , Simplest process.
Quick Information
Thrust Areas
Physical Sciences
Focus Area
Electroplating
Status
completed
Contact
director@cecri.res.in
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