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Lead Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer

Implementing Organization

Project Overview

The plated Cu-Sn alloy and Ag-Bi bilayer gives good mechanical properties than Cu-Pb-Sn alloy for bearing applications. With this technology we can eliminate hazardous Pb in the alloy compositions. The technology provide good mechanical properties and plating rate.
Quick Information
Thrust Areas
Chemical Sciences
Focus Area
Industrial appliances
Output
TRL: Technology Readiness Level
Technology Demonstration
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