Lead Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer
Implementing Organization
Project Overview
The plated Cu-Sn alloy and Ag-Bi bilayer gives good mechanical properties than Cu-Pb-Sn alloy for bearing applications. With this technology we can eliminate hazardous Pb in the alloy compositions. The technology provide good mechanical properties
and plating rate.
Acces sibility Controls