Lead Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer
Implementing Organization
Central Electrochemical Research Institute (CECRI)
About
The plated Cu-Sn alloy and Ag-Bi bilayer gives good mechanical properties than Cu-Pb-Sn alloy for bearing applications. With this technology we can eliminate hazardous Pb in the alloy compositions. The technology provide good mechanical properties
and plating rate.
Disclaimer:
Information available on this portal is sourced from various organizations and is provided for informational purposes only. Users are advised to verify details from the respective official sources.
Please enter your details
Please provide your name and email to continue. Your details are saved in this browser for future use.
Latest Updates
Loading…
⚠️
You are leaving this website
You are about to be redirected to an external website that is not operated by
India Science, Technology & Innovation (ISTI) Portal.
Central Electrochemical Research Institute (CECRI)
Acces sibility Controls